Product Introduction

The UV picosecond cutting machine utilizes UV picosecond laser technology for non-contact, heat-affected-zone-free, ultra-high-precision laser micro-machining. Specifically designed for precision processing of hard and brittle materials as well as flexible electronic materials, it is an ideal processing platform for cutting-edge fields such as 5G communication, semiconductors, display panels, and flexible electronics.

Cold processing light source, minimal heat-affected zone

Cold-processed light source, minimal heat-affected zone.

Using picosecond-level ultraviolet laser, no blackening, no carbonization, no micro-cracks, achieving a "cold processing" effect.ving a "cold processing" effect

Fully Enclosed Protection Design

Full enclosure protection design

Isolate laser radiation to ensure operational safety

Marble Platform

Marble platform

Micron-level flatness for stable cutting reference.

Zero-waste cutting, extrSwift and Fast Micron-Level Transmissioneme material saving

Swift and fast μ-stage transmission

Linear motor module, fast response speed, zero-wear non-contact transmission, micron-level high-precision cutting

Fully Enclosed Optical Path

Fully enclosed optical path

Fully sealed design of the laser transmission path, dust and contamination resistant, ensuring more precise and durable cutting.

Visual Recognition and Positioning

Visual recognition and positioning

Intelligently identifies workpiece placement position, automatically corrects deviations, and improves yield rate.

Flexible Expansion, Smart Factory

Flexible expansion, smart factory

Supports stand-alone operation or integration into automated production lines (robots, loading/unloading systems, etc.), easily connects to Industry 4.0 systems, and facilitates intelligent manufacturing upgrades.

Applicable Industries

Hard and brittle materials (e.g., glass, ceramics, LCD panels), electronic circuit materials (e.g., flexible printed circuits (FPC), rigid-flex boards (RF), coverlay (CVL))